Thermal Accumulation in Low-Conductivity Polymers
Heat Accumulation Zones by Wavelength
Thermal Conductivity Impact on Marking
Polymers have thermal conductivities 100-1000x lower than metals, creating unique challenges:
| Material | Thermal Conductivity (W/m·K) | Heat Dissipation | Marking Behavior |
|---|---|---|---|
| Aluminum (reference) | 237 | Rapid | Clean marking possible |
| PEEK | 0.25 | Very slow | Heat accumulation issues |
| PLA | 0.13 | Extremely slow | Severe thermal damage |
Critical Physics Relationship
When optical penetration depth exceeds the thermal damage threshold depth, foaming becomes inevitable. The relationship is:
Foaming Risk = δ / (k × τ)
Where δ = penetration depth, k = thermal conductivity, τ = pulse duration
High risk values indicate the need for physics optimization to achieve clean marking.